|
型 号
|
厂 家
|
封 装
|
批 号
|
|
KMJJS000WM-B409
|
SAMSUNG
|
BGA
|
22+
|
|
KIA278R05
|
KEC
|
TO-220F-L4
|
22+
|
|
KSZ8721
|
microchip
|
48/LQFP 48/SSOP 48/TQFP
|
22+
|
|
K2391
|
TOSHIBA
|
TO-220
|
22+
|
|
K2477
|
NEC
|
TO-247
|
22+
|
|
K24C08D
|
华虹-NEC
|
DIP SOP8 TSSOP
|
22+
|
|
K4N51163QZ-HC25
|
SAMSUNG
|
FBGA
|
22+
|
|
K1149
|
NEC
|
TO-3PF
|
22+
|
|
K3543
|
TOSHIBA
|
TO-220F
|
22+
|
|
KBL507
|
SEP
|
DIP/SOP/SSOP/QFP
|
22+
|
|
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